YANG SONG


CURRENT ADDRESS:


1234 E, ALAMEDA AVE. #23 SALT LAKE CITY, UT 84102


PERMANENT ADDRESS:


EMRO 304 UNIVERSITY OF UTAH, SALT LAKE, UT 84102


OBJECTIVE:

My goal is to acquire an entry level engineer position or a co-op opportunity with the potential for advancement.


EDUCATION:

BS: Chongqing University, Chongqing, China

BS 1987 To 1991, Materials Science and Engineering
Major GPA: 4.0/4.0, Overal GPA:4.0/4.0

MS: University of Utah


Materials Science and Engineering, Major GPA: 3.6/4.0, overall GPA: 3.5/4.0


HONORS:

EXCELLENT GRADUATE IN 1991
EXCELLENT THESIS

RELEVANT EXPERIENCE FROM 1991 TO 1993

COMPANY: GUOGUANG ELECTRONICS , CHINA
POSITION: ENGINEER
RESPONSIBILITY: MATERIALS EXAMINATION AND TESTING, IC DESIGN AND TESTING

SKILLS:

VLSI DESIGN WITH POWERVIEW AND CADENCE
IC DEVICE FABRICATION
UNIX AND C++ PROGRAMMING
SEMICONDUCTOR PROCESSING(OMVPE)
VISUAL C++/BASIC PROGRAMMING
TEM, SEM AND X-RAY CHARACTERIZATIONS
MICROMACHINING USING SILICON PROCESSING TECHNOLOGY
HTML WEB PUBLICATION

RELEVANT COURSES:

ELECTRICAL ENGINEERING

VLSI CAD (POWERVIEW)
ADVANCED CMOS VLSI DESIGN(CADENCE)
SEMICONDUCTOR PROCESSING(OMVPE)
SEMICONDUCTOR DEVICE PHYSICS(I , II)
ADVANCED SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE FABRICATION LAB
BIO-BASED MICROMACHINING(I, II)
ADVANCED VLSI ANALOG CIRCUIT DESIGN(ACME)
ADVANCED ELECTRONIC DEVICE

RELEVANT COURSES:

MATERIALS SCIENCE AND ENGINEERING

TEM ANALYSIS
SEM ANALYSIS
X-RAY ANALYSIS
ADVANCED POLYMER SCIENCE
THERMAL DYNAMICS
KINETICS
PHYSICAL METALLURGY
ENGINEERING MATERIALS


Current Activity in University of Utah


Recent Activity in University of Utah


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